Intel Ivy Bridge-E Power Density Revealed - Might Discourage Overclocking - millersircond

Intel Ivy Bridge-E Great power Density has just been revealed. Intel recently discharged pictures of the Wafers for Intel Ivy Bridge-E and a guy has deliberate using Gimpiness and several futuristic algorithms, the Power Concentration of Intel Ivy Span-E's Power Concentration to be about 0.5W/mm² which is just about double of Sandlike Bridge-E's Power Density of 0.345W/millimetre².

Intel Ivy Bridge-E Power Density

Intel Ivy Bridge-E's Increased Office Density Could Skilled Fewer Overclocking

First lets undergo how the blackguard measured Intel Common ivy Bridge-E's Magnate Compactness. Via Intel's released pictures we rump see that the news about Intel Ivy Bridge-E having an Actual 6 Heart and soul Die as opposed to a mutilated 8 core die are true. This gives rise to better ability to control the big businessman consumption, cost and sized of the chip. This is also essential in shrewd the Intel Ivy Bridge over-E Power Concentration.

Using much otherwise critical data, we can theoretically calculate the Nitty-gritty Area victimization image pixels per square mm. Victimization the images it can be calculated that the Intel English ivy Bridge-E processor heart and soul area to be 258.37-259.84mm ² with an mistake percent of 1%. Compare this to Sandy Bridge deck-E's Essence Area of 435mm² (with 8 cores).

Intel's Ivy Bridge over-E Exponent Density is higher then any strange series, Sandy OR Ivy. Compare Intel Ivy Bridge-E's Mogul Density of 0.5W/mm² to Ivy Bridge Power Density of 0.481W/mm², Beachlike Bridge Power Density of 0.440W/millimeter², Loose Bridge circuit-E Power Density of 0.345W/mm² A Haswell's Index Denseness of 0.475W/mm².

Intel Ivy Bridge-E Power Density

How Exactly would Intel Ivy Bridge circuit-E Power Density Affect Overclocking?

Basically More Power Density would mean many heat waste per guileless mm. The More heat dissipation per square millimetre the less the overclocking capability because heat would step-up exponentially with all hyperbolic clock. Thought IT must be kept in mind that this is pure speculation,r the fact that Intel is sledding with Soldered warmth dissipation method acting atomic number 3 conflicting to a thermal paste solution is a clear indicator of a probable heat problem. Then again the Soldered method might just sterilise the enlarged estrus dissipation per square mm.

Intel Ivy Bridge-E Power Density